Manifolded fluid delivery system

ABSTRACT

An integrated fluid delivery system (IFDS) is provided for delivering fluid streams such as high purity fluid streams to a processing destination, such as a wafer processing chamber. The delivery system includes a first modular manifold for internally channeling the high purity fluid streams along seamless slots. The first modular manifold receives each of the high purity fluid streams at a corresponding porting aperture. At least one fluid device from a group consisting of a flow controller, a valve, a filter and a pressure transducer is provided. The at least one fluid device is in fluidic communication with a corresponding one of the high purity liquid streams of the first modular manifold to dispense the high purity fluid streams from the integrated liquid delivery system to the wafer processing chamber.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of the priority date ofProvisional U.S. patent application Ser. No. 60/271,947 filed Feb. 28,2001 for subject matter disclosed therein.

[0002] 1. Field of the Invention

[0003] The present invention relates, in general, to a fluid deliverysystem. More particularly, this invention provides an integrated fluiddelivery system (IFDS) for providing high purity fluid streams, such asfor a wafer processing chamber.

[0004] 2. Background of the Invention

[0005] High purity fluid delivery systems are employed in demandingmanufacturing environments such as the semiconductor manufacturingindustry. The delivery systems are designed to precisely dispense fluidswhich may be hazardous in nature (i.e., corrosive, poisonous) and/orexpensive. For example, in semiconductor processing/manufacturing,various stages such as low pressure chemical vapor deposition (LPCVD),oxidation, and plasma enhanced chemical vapor deposition (PECVD),require corrosive precursors such as boron, silicon and phosphorous tobe delivered to a wafer processing chamber for the manufacture ofsemiconductor devices.

[0006] Typically, high purity fluid systems in the semiconductormanufacturing industry employ a complex network of tubing (plumbing)that require high integrity welds between tube sections and conduitassemblies for channeling the fluids to a variety of fluid control,metering, and operational devices. As the layout of each system isdependent upon the number and location of the control, metering andoperational devices, the “system schematic” is equal in complexity tothe number of high integrity welds and corresponding conduitarrangement.

[0007] As can be appreciated, the number of high cost conduit assembly(i.e., valving) and high integrity welding connections, as well as theincreased complexity of the corresponding system schematic leads toliquid delivery systems which are costly to both maintain andmanufacture. Indeed, bulky conduit assemblies requiring even a mereadditional square foot can be cost prohibitive in the valuable realestate of clean room environments, where the cost to build per squarefoot is especially expensive.

[0008] Moreover, repairing a faulty weld or replacing a flow devicecomponent often necessitates disassembly of a substantial portion of theliquid delivery system. This also increases the down time of the processincorporating the component. For example, there is shown in FIG. 1, atypical prior art liquid delivery system 5. Liquid delivery system 5utilizes a conduit assembly 7 which employs a plurality of conduitsections 10, high integrity welds (not shown) and flow devices 12 fordelivering high purity liquid streams from system 5. Flow devices 12 canbe any device known in the art for processing a fluid, but typicallyinclude flow controllers, valves, filters and pressure transducers. Asshown in FIG. 1, conduit based system 7 requires a large degree ofavailable area inside the cabinet of liquid delivery system 5. Thus, inthe case where a particularly hard to reach component or weld requiresmaintenance and/or replacement, a significant portion of system 7 wouldneed to be disassembled. As can be appreciated, conduit system 7 iscomplex and costly to assemble and operate. For example, conduit system7 has a higher overall resistance to fluid flow than lesser complexsystems, thus an increased “down time” is required to purge the systemof fluids where necessary.

[0009] To provide a precise volume of fluid to a processing application,fluid delivery systems may comprise a flow controller. Typically, flowcontrollers couple a sensor for measuring flow volume with a valve foradjusting flow volume. Measuring the flow volume of an entire fluidstream, however, can lead to long response time. Some flow controllersemploy a fluid bypass, measuring the flow volume of a small portion ofthe flow and inferring the flow volume in the bypass. These flowcontrollers, however, employ methods for maintaining the necessarypressure differential that are expensive, have high part counts that addtolerances and cost, or are difficult to manufacture yielding inadequateaccuracy or repeatability. Examples of such bypass flow controllersinclude those using a bundle of tubes or a sintered metal slug.

[0010] Additionally, atomizing and/or vaporizing a liquid in a gasstream is often necessary in high purity fluid processing applications.For example, these processes may be employed to deposit high-purity,metal oxide films on a substrate. Moreover, the liquid mixtures may alsobe utilized for spray coating, spin coating and sol-gel deposition ofmaterials. In particular, chemical vapor deposition (CVD) is anincreasingly utilized high purity fluid delivery process for formingsolid materials, such as coatings or powders by way of reactants in avapor phase. Typically, a reactant vapor is created by heating a liquidto an appropriate temperature and bubbling a flow of carrier gas throughthe liquid (i.e. high purity fluid stream) to transport the vapor into aCVD chamber. Specifically, a gas stream and liquid stream are introducedinto a single channel or conduit at a T-junction. The CVD system pumps afluid stream at a steady, controlled rate into a hot region which mayinclude ultrasonic energy for effecting the mixture components. However,this technique creates a dead volume of material upon discontinuance ofthe process. Further, bubbling can often be an unpredictable method ofvaporization, in which the precise quantity of the liquid reactant isdifficult to control.

[0011] Accordingly, there is a need for an atomizer which predictablyatomizes a fluid while eliminating dead volume upon discontinuance ofthe atomization process. Also, there is a need for an accurate, reliableand inexpensive flow controller. Similarly, there is a need for anintegrated liquid delivery system wherein the system schematic can beconsolidated to a single modular manifold device.

SUMMARY OF THE INVENTION

[0012] The present invention provides an integrated fluid deliverysystem (IFDS) for providing fluid streams to a destination. In anexemplary embodiment, the delivery system includes a first modularmanifold for internally channeling the fluid streams along seamlessslots. The first modular manifold receives each of the fluid streams ata corresponding porting aperture thereof. At least one fluid device froma group consisting of a flow controller, a valve, a filter and apressure transducer is provided. The at least one fluid device is influidic communication with a corresponding one of the fluid streams ofthe first modular manifold to dispense the high purity fluid streamsfrom the integrated liquid delivery system to a destination, such as awafer processing chamber.

[0013] It is to be understood that both the foregoing generaldescription of the invention and the following detailed description areexemplary, but are not restrictive, of the invention.

BRIEF DESCRIPTION OF THE DRAWING

[0014] The invention is best understood from the following detaileddescription when read in conjunction with the accompanying drawing.Accordingly, the present invention will now be described by way ofnon-limiting examples with references to the attached drawing, in which:

[0015]FIG. 1 is a perspective view of a prior art Fluid Delivery System;

[0016]FIG. 2 is a perspective view of the manifolded fluid deliverysystem in accordance with one embodiment of the present invention;

[0017]FIG. 3 is an exploded view of the manifold assembly of the fluiddelivery system in accordance with FIG. 2;

[0018]FIG. 4 is a perspective view of the manifold assembly of FIG. 3showing seamless slots in phantom;

[0019]FIG. 5 is a sectional view of the manifolded fluid delivery systemof FIGS. 1-4 taken along lines 3-3 of FIG. 3;

[0020]FIG. 6A is an enlarged view of the area designated by referencenumeral 27 of FIG. 4.;

[0021]FIG. 6B is a sectional view taken along lines 6B of FIG. 6A;

[0022]FIG. 7 is a system schematic of the manifolded fluid deliverysystem of FIG. 2;

[0023]FIG. 8 is a bottom exploded view of the manifold assembly of amultilayered manifolded fluid delivery system in accordance with oneembodiment of the present invention;

[0024]FIG. 9 is a longitudinal sectional view of a flow controller foruse in an integrated fluid delivery system according to one embodimentof the present invention;

[0025]FIG. 10A is an exploded perspective view of a sub-assembly of theflow controller of FIG. 9;

[0026]FIG. 10B is an exploded perspective view of a sensor channel forthe flow controller of FIG. 9;

[0027]FIG. 11 is a system schematic of the embodiment of the presentinvention shown in FIG. 9;

[0028]FIG. 12 is a top view of a mixing slot of an atomizer inaccordance with an embodiment of the present invention;

[0029]FIG. 13 is an exploded view of an atomizer/vaporizer in accordancewith an exemplary embodiment of the present invention; and

[0030]FIG. 14 is a heat exchanger for use in an integrated fluiddelivery system in accordance with an embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

[0031] Certain terminology used in the following description is forconvenience only and is not limiting. The words “right,” “left,” “lower,” and “upper” designate directions in the drawings to whichreference is made. The words “inwardly” and “outwardly” refer todirections toward and away from, respectively, the geometric center ofthe liquid delivery system and manifold in accordance with the presentinvention and designated parts thereof. The terminology includes thewords noted above as well as derivatives thereof and words of similarimport. The term “seamless” is generally defined as designating acontinuous slot surface connecting corresponding manifold apertures.

I. Single Sided Manifold

[0032] In accordance with the present invention, an integrated fluiddelivery system (IFDS) is provided to dispense fluid streams. In anexemplary embodiment, the fluid streams are of high purity. The highpurity fluid streams are typically utilized to manufacture semiconductordevices and typically process such fluids as silicon, boron andphosphorous precursors for delivery to a processing destination, such asa wafer processing chamber. Those skilled in the art will recognize,however, that the present invention is applicable to any number of fluidstream chemistry and/or manufacturing environments.

[0033] Referring now to the figures in detail, wherein like numeralsindicate like elements throughout, there is shown in FIGS. 2-6B, amanifolded fluid delivery system 15 in accordance with the presentinvention. Fluid delivery system 15 includes a first modular manifold or“base” 16 for internally channeling the high purity fluid streams alongseamless integrated slots 18 (shown best in FIG. 3) formed therein.

[0034] As shown in the exemplary embodiment, base 16 is a substantiallyplanar, rectangular substrate or plate having first and second surfaces20 and 22, respectively. Other shapes of base 16 can be used dependingon the application. In an exemplary embodiment, base 16 is formed ofstainless steel type 316L VAR (low carbon vacuum arc re-melt) selectedfor its high corrosion resistance. Other materials suitable for thefluids used in a particular application will be understood by thoseskilled in the art. The thickness of base 16 is suitable to theapplication and/or volume of chemicals to be processed therethrough.

[0035] One or more flow/processing devices 12 are mounted on respectiveinterconnects 24. Interconnects 24 are mounted to base 16 via a mountingmeans, such as bolts (not shown), that are positioned through mountingholes 26. In an exemplary embodiment, mounting bolts are bolted tothreaded interconnect apertures 28. In an exemplary embodiment,interconnects 24 are removable to allow for repair, maintenance,replacement or redesign of the IFDS and/or its component parts.

[0036] As shown in FIG. 3 and FIG. 4, base 16 includes at least one, andtypically a plurality of seamless slots 18 (i.e., integrated seamlessslots), interconnect apertures 28 (FIG. 4), and slot porting apertures30 (FIG. 4) that are all formed on at least one of two major surfaces orfaces thereof. In an exemplary embodiment, slot porting apertures 30 aremetallic sealed. Other materials may be suitable for the seals,depending upon the application. Interconnect apertures 28 which may bethreaded are arranged in a flow device footprint adapted for receivingan interconnect for mounting a corresponding flow device 12. One or bothof first and second surfaces 20 and 22 can include seamless slots 18.

[0037] Seamless slots 18 are provided to consolidate a system schematic,such as shown in FIG. 7 onto surfaces 20 and/or 22 of base 16 forproviding a modular manifold component. The depth of slots 18 issuitable to the application and/or volume of chemicals to be processedtherethrough. In an exemplary embodiment, the system schematic isconfined to a first surface 20 and seamless slots 18 are generallysubstantially elliptical in cross section. In another exemplaryembodiment, seamless slots 18 are conical in cross section truncatedwith a tangential rounded radius as shown in FIG. 5.

[0038] Seamless slots 18 may be chemically etched and polished to avoidparticulate entrapment. In an exemplary embodiment, seamless slots 18are polished down to less than 16 rms for removing the grain structureof the metal surface of base 16. The metal surface of base 16 can bepolished by extruding a polymer loaded with abrasives through base 16 ata high pressure through the use of polyurethane mill tooling. The uniqueshape of slots 18 is designed to complement the tooling for finishingpurposes. Rectangular slots diminish the polishing ability of the milltooling as rectangular slots have sharp corners that are difficult toaccess. Alternatively, seamless slots 18 may be formed by machining orother methods known in the art.

[0039] As shown in FIG. 4, seamless slots 18 include, along surfacesthereof, first slot porting apertures 30 extending from a surface ofseamless slots 18 through to another base surface (22 in FIG. 4), forchanneling high purity fluid streams therethrough.

[0040] As shown best in FIGS. 5, 6A, and 6B slot porting apertures 30are finished with a detail 32 or “counterbore” to receive acorrosion-resistant seal. A corrosion-resistant seal such as a z-seal orc-seal, is used (in an exemplary embodiment, but not shown) uponconnection of a corresponding flow device 12 or pneumatic control line.Corrosion-resistant seals, as used in an exemplary embodiment, require ahigher tolerance finish (i.e., less than 16 rms) than that used forelastomeric fittings. The specifics of machining the appropriate finishfor receiving the selected commercially available seal is understood bythose skilled in the art. In some applications, it may be possible touse non-metallic, corrosion-resistant seals.

[0041] As shown in FIGS. 2 and 3, interconnects 24 are provided betweenboth slot porting apertures 30 and a desired flow device 12.Interconnects 34 which may be attached to a low leakage fitting 36 (suchas a VCR fitting manufactured by Swagelok Company of Solon, Ohio) as asingle piece, are also provided between porting apertures 30 and desiredflow device 12. Interconnect 34 is mounted to base 16 via mountingapertures 38 (bolts not shown). Interconnects 24 are typicallycommercially available fittings such as those manufactured by SwagelokCompany. of Solon, Ohio having a detail corresponding to that ofapertures 30 for seating the corrosion-resistant seal. Base 16 receivesinterconnects 24 by way of bolting through interconnect apertures 28. Inan exemplary embodiment, a commercially available corrosion-resistantseal (not shown) is constructed of nickel and is interposed betweenapertures 30 and interconnect 24 for forming a compression fitting. Thematerial of the seal should be a softer metal with respect to base 16 sothat upon seating interconnect 24 on base 16 the seal is compressed anddeforms to seal the connection upon bolting or other securing means.

[0042] A face plate 40 is shown in FIG. 3, having a first and secondsurface. Face plate 40 is sealed or joined to first surface 20 of base16 for enclosing seamless slots 18. Face plate 40 can be sealed toeither first or second surface 20 or 22 of base 16 depending upon theapplication. A brazing medium 42 is disposed between base 16 andfaceplate 40 and is utilized to seal face plate 40 to a desired surfaceof base 16 by brazing. In an exemplary embodiment, a nickel brazingmedium 42 is used for the brazing process and base 16 is secured to faceplate 40 by vacuum brazing. In this way, face plate 40 is joined withbase 16, so that a first surface of face plate 40 abuts a surface (suchas first surface 20) of base 16.

[0043] Face plate 40 may additionally include corrosion-resistant sealedplate porting apertures 44 positioned to overlay slots 18 of base 16. Insuch an embodiment seamless slots 18 can be accessed by a processingdestination such as a wafer processing chamber through or from flowdevice 12. Plate porting apertures 44 are likewise finished with adetail 32 (as shown in slot porting apertures 30 in FIGS. 6A and 6B) or“counterbore” to receive a corrosion-resistant seal (such as a z-seal orc-seal, not shown) upon connection of a corresponding flow device orpneumatic control line to introduce the fluid streams to base 16. Thepresent invention can be practiced without employing corrosion-resistantsealed plate porting apertures 44. Moreover, the thickness of face plate40 is a matter of design choice for maintaining non-deformity whensecuring instrumentation to any resident plate porting apertures 44.

[0044] In an exemplary operation, base 16 receives each of the highpurity fluid streams at a corresponding corrosion-resistant sealed slotporting aperture 30 for transporting a fluid along seamless slots 18.Corrosion-resistant sealed porting apertures 30 receive, upon connectionof a corresponding flow device or pneumatic control line or the like,fluid streams for transport of one or more fluids through seamless slots18 of base 16.

[0045] Slot porting apertures 30 are in fluidic communication withadditional slot porting apertures located along seamless slots 18, aswell as plate porting apertures 44 for channeling high purity fluidstreams between slots in different bases. In embodiments where faceplate 40 may not employ plate porting apertures 44, fluid would flowalong seamless slots 18 between corresponding slot porting apertures 30.Once mated to an interconnect fitting 24, fluid device 12 is in fluidiccommunication with a corresponding one of the high purity liquid streamsof base 16.

[0046] As shown in FIG. 7, an entire system schematic can beconsolidated to base 16 with the corresponding valving and flow devicesinterconnected thereto for eliminating the need for the bulky conduitassemblies of the prior art. In this way, base 16 provides a modularsystem schematic for dispensing the fluid streams from integrated fluiddelivery system 15 to processing destination such as a wafer processingchamber or other device requiring fluid streams.

II. Multisided Manifold

[0047] In a further embodiment, a second base 16B is provided as shownin FIG. 8 having similar details as base 16. The features of second base16B are identified by a reference numeral followed by the letter “B”.Second base 16B also has a first and second surface 20B and 22Brespectively. Second base 16B also includes integrated seamless slots18B formed thereon for channeling a fluid stream therethrough. Secondseamless slots 18B include, along surfaces thereof, second slot portingapertures (not shown) which are corrosion-resistant sealed portingapertures extending from the surfaces of the second slots 18B throughthe second base 16B. Second base 16B is sealed to an available side offace plate 40 in the same manner as that of the embodiment shown in FIG.3. Plate porting apertures 44 overlay the slot porting apertures of theintegrated slots 18B and the faceplate is interposed between first base16 and second base 16B so that interconnect apertures 28 and 28B are inalignment.

[0048] In an exemplary embodiment, slot porting apertures in second baseplate 16B are in fluidic communication with slot porting apertures 30which are also through first slots 18 and second slots 18B forchanneling fluid streams therebetween.

[0049] A second face plate (not shown) is connected to first surface 20Bof base 16B for sealing slots 18B. It will be understood by thoseskilled in the art that any number of base sections 16 can be layered inthis manner depending upon the particular application and that theinvention described herein is not limited to the illustration but usedabove for explanatory purposes only.

[0050] III. Liquid Mass Flow Controller

[0051] Referring now to FIGS. 9-11, an exemplary embodiment of thepresent invention is shown in which base 16C is interconnected with aflow processing device to form a flow controller 46.

[0052] As shown in FIG. 9, a liquid flow controller assembly 46 employsa base 16C and an interconnect plate 48. In an exemplary embodiment,base 16C includes a seamless slot 18C (best shown in FIG. 9) betweenbase 16C and interconnect plate 48. As above, with respect to base 16,base 16C and interconnect plate 48 are joined together by a brazingmedium 42 using a vacuum brazing process. In an exemplary embodiment,base 16C can be vacuum brazed, at slot face 20C directly to second face45 (shown in FIG. 10A) of interconnect plate 48 of liquid flowcontroller assembly 46. Seamless slots 18C may be formed by machining,etching, or other processes known in the art. Base may be a plate (orslot plate) having two opposing surfaces or faces, one of these facesbeing slot face 20C. In this way, slot face 20C and second face 45 abutso that seamless slot 18C is sealed by the abutment.

[0053] Porting apertures 50 are formed within interconnect plate 48positioned to align with seamless slot 18C and extending to the firstface 43 of interconnect plate 48 to allow the flow of liquid into andout of, a formed sensor channel 52 (discussed below). In an exemplaryembodiment, porting apertures 50 are corrosion-resistant sealed similarto those corrosion-resistant sealed apertures previously discussedherein. Porting apertures 50 may provide for a portion of the liquidstream to flow into and through the sensor channel of the flowcontroller. As such, porting apertures 50 may be finished with a detail32 or “counterbore.” Detail 32 is provided for receiving acorrosion-resistant seal (such as a z-seal or c-seal not shown) uponconnection of a corresponding flow device or pneumatic control line tointroduce or outlet, fluid streams between is base 16C.

[0054] Flow controller 46 includes a sensor channel 52 (best shown inFIG. 9) for providing a pathway for a fluid stream of base 16C. Sensorchannel 52 in sensor area 56 carries a portion of the fluid streamtransported into base 16C, with the remainder to be carried alongseamless slot 18C. Sensor channel 52 is provided for measuring a changein temperature or temperature gradient (ΔT) of the portion of fluidflowing therein across points A and B in FIG. 11.

[0055] Sensor channel 52, as shown in FIGS. 9 and 10B, comprises a tubesection in fluid communication with seamless slot 18C through portingapertures 50 in interconnect plate 48. In a preferred embodiment of thepresent invention, sensor channel 52 extend downwardly from seamlessslot 18C through a sensor plate 49 and into a sensor area 56 of a sensorhousing 61, such that sensor channel 52 is at a lower elevation thanseamless slot 18C. Two temperature sensors 57 are mounted on sensorchannel 52 with a heater 59 is mounted on the sensor channel between thetemperature sensors. In an exemplary embodiment, the sensors and heatercomprise wire windings wrapped about the tubing. The heater transfersheat to the fluid to raise the fluid temperature up to 30 degreesCelsius. In an exemplary embodiment, however, the fluid temperature israised about 5 degrees Celsius to avoid degradation of certainprecursors that may be used with flow controller 46. In an exemplaryembodiment, the sensor channel 52 extends downwardly to reduce blockageof the sensor channel by gas bubbles carried in the fluid stream.

[0056] In an exemplary embodiment of the invention, buttons 53 arewelded to the ends of sensor channel 52. Buttons 53 are positioned incounterbores in sensor plate 49, and corrosion-resistant seals arecompressed between buttons 53 and interconnect plate 48. Spacers 55 maybe positioned inside the corrosion-resistant seals. Then sensor plate 49is fastened to interconnect plate 48, such as with bolts, and sensorhousing 61 is fastened to sensor plate 49.

[0057] Slot porting aperture 51 is formed in seamless slot 18C,extending through base 16C and providing fluid communication betweenseamless slot 18C and flow control valve 54. Flow control valve 54 isoperably connected to temperature sensors 57. The temperature difference(ΔT) infers the flow through seamless slot 18C, and this temperaturedifference is used to generate an output signal voltage. The flowcontroller 46 can be used to adjust the mass flow through the flowcontroller 46 by adjusting the opening of flow control valve 54. Controlelectronics adjust the opening of flow control valve 54 until the outputsignal voltage is equal to a predetermined set-point in the controlelectronics corresponding to a desired mass flow rate. In an exemplaryembodiment, the set-point is determined by a variable resistor, such asa potentiometer. Flow control valve 54 may be a suitable valve for theparticular application that can be electronically adjusted to provide avariable flow rate. In an exemplary embodiment, flow control valve 54 isa piezotranslator, in which stacked ceramic disks press against aflexible metal diaphragm to open or close the diaphragm againstapertures in a fluid pathway. The pressure applied by the ceramic disksis proportional to a voltage applied to them. The flow rate isdetermined by the gap between the diaphragm and the flat surface havingthe apertures in it (up to about 0.002 inches in an exemplary flowcontrol valve).

[0058] Referring more particularly to FIG. 11, a system schematic ofbase 16C and flow controller 46 is shown. Inlet 58 into base 16C is ahigh pressure inlet which branches into two separate pathways. The firstpathway is seamless slot 18C for providing a bypass pathway or channel.The second pathway is sensor channel 52. Flow valve 54 is in fluidiccommunication with seamless slot 18C for receiving the portion of fluidflowing through sensor channel 52 (which is proportional to the flowthrough seamless slot 18C) and the portion of fluid flowing throughseamless slot 18C. Seamless slot 18C provides a pressure drop frompoints 1 to 2 in FIG. 11. Sensor channel 52 and seamless slot 18C are influidic communication with a low pressure outlet 60, through controlvalve 54.

[0059] The change in temperature across points A and B of sensor channel52 corresponds to an actual fluid flow through the flow controller 46and has a very low response time on the order of 3 seconds or less. Thisis an improvement over the simple sampling of a single fluid stream assuch an arrangement yields very slow response time (e.g., 20 seconds).This arrangement provides a fast and accurate reading of fluid flow.This mass flow controller can be a modular component for use in an IFDS.

IV. Atomizer

[0060] In accordance with another exemplary embodiment of the presentinvention, an atomizer for combining separate gas and liquid streams isprovided. This atomizer can be a modular component for use in an IFDS. Amixing point is defined by the junction of a liquid inlet to a mixingslot. A gas stream inlet is in fluidic communication with a side of themixing slot. A mixture outlet defines the remaining side of the mixingslot. A gas stream flowing into the mixing point is accelerated to ahigh velocity, reducing pressure for drawing the liquid into the gasstream by venturi effect.

[0061] There is shown in FIG. 12 a mixing slot 62 of an atomizer 64 forcombining separate gas and liquid streams. Mixing slot 62 has a mixingpoint 66 for atomizing a liquid stream into a gas stream. A stream ofthe high purity mixture of fluid and gas are utilized, for example, todeposit high-purity, metal oxide films on a substrate in processes suchas semiconductor manufacturing. Moreover, the liquid and gas mixturesmay also be utilized for spray coating, spin coating and sol-geldeposition of materials. Those skilled in the art will recognize,however, that the present invention is applicable to any number offluid/gas stream chemistry and/or manufacturing environments.

[0062] Atomizer 64 includes a base member 16D having a mixing slot 62formed in a face thereof for producing a venturi effect at a mixingpoint 66. In the exemplary embodiment shown, base 16D is a substantiallyplanar, rectangular substrate formed of type 316 stainless steel (lowcarbon vacuum arc re-milled) LVAR selected for its high corrosionresistance. Other shapes of base 16D can be used depending on theapplication, and other materials suitable for the fluids/gases used in aparticular application may be used as will be understood by thoseskilled in the art. The thickness of base 16D is suitable to theapplication and/or volume of chemicals to be processed therethrough. Anexemplary base member structure is shown in FIG. 12 and described below.Mixing slot 62 may be formed by machining, etching, or other processesknown in the art.

[0063] Mixing slot 62 of base member 16D has a gas input side 82 and amixture side 88. In an exemplary embodiment, mixing slot 62 is generallyhourglass shaped. Gas input side 82 and mixture side 88 are eachsubstantially triangular in shape and are in fluid communication througha throat joining their respective apices. A mixing point 66 is locatedat the throat of the hourglass shape. The venturi effect is caused bythe narrowing of the gas input side 82 and mixture side 88 of thehourglass shape, which increases the velocity of the gas lowering thepressure and drawing liquid into the gas stream. The particular fluiddynamics of the venturi effect will be understood by those skilled inthe art.

[0064] A liquid inlet 80 is in fluidic communication with mixing point66 of mixing slot 62. Mixing point 66 is defined by the junction ofliquid inlet 80 and mixing slot 62. A gas stream inlet 84 is in fluidiccommunication with gas input side 82 of mixing slot 62. A valve (notshown) proximate to mixing point 66 may be provided for controlling theintroduction of a liquid stream through liquid inlet 80 and eliminatingdead volume upon discontinuance of the process as it controls the entryof the liquid stream at mixing point 66. A mixture outlet 90 is influidic communication with mixture output side 88 of mixing slot 62. Aface plate 40D abuts base member 16D sealing mixing slot 62.

[0065] The atomizer described herein may be provided as a modularcomponent for use in an IFDS.

V. Atomizer/Vaporizer

[0066] In one exemplary embodiment, as shown in FIG. 13, a mixing slotfor atomizing a liquid into a gas stream, and a mixture heating slot forvaporizing the atomized liquid in the mixture are combined to form avaporizer 64E. A base member 16E has a mixing slot 62, as describedabove, formed in one of its faces for producing a venturi effect at amixing point 66. A gas slot 70 and a mixture heating slot 72 are formedin base member 16E in fluid communication with the gas input side 82 andmixture side 88, respectively, of mixing slot 62. Base member 16Einternally channels gas and fluid streams along seamless slots 70 and72. In the exemplary embodiment shown, base 16E is a substantiallyplanar, rectangular substrate having first and second surfaces 74 and78, respectively. Other shapes of base 16E can be used depending on theapplication. In this exemplary embodiment, base 16E is formed ofstainless steel type 316 LVAR (low carbon vacuum arc re-milled) selectedfor its high corrosion resistance. Other materials suitable for thefluids/gases used in a particular application will be understood bythose skilled in the art. The thickness of base 16E is suitable to theapplication and/or volume of chemicals to be processed therethrough.

[0067] In an exemplary embodiment, gas slot 70 is provided having a gasinlet side 84 and a gas outlet side 86. Gas outlet side 86 of gas slot70 is connected to gas input side 82 of mixing slot 62. In an exemplaryembodiment, as shown in FIG. 13, gas slot 70 is a serpentine pathway forheating the gas stream to either a predetermined or adjustabletemperature. The degree of heating is dependent upon the length of thepathway and type of gas, as well as other factors (e.g., gas velocityand temperature difference between gas and base). The gas stream flowinginto a mixing slot may be heated to reduce the heat required to be addedto the mixture stream for vaporization.

[0068]FIG. 13 shows mixture heating slot 72 in fluidic communicationwith mixture side 88 of mixing slot 62. Mixture heating slot 72 has amixture inlet 90 and a mixture outlet 92. Mixture heating slot 72 isconnected to mixture side 88 of mixing slot 62. In operation a gasstream flows through gas slot 70, into mixing slot 62, and then tomixing point 66. The velocity of the gas stream is increased in velocityby the narrowing of gas input side 82 lowering the pressure at mixingslot 62 and generating a venturi effect. In this way, portions of theliquid stream are drawn into the gas stream to provide an atomizedmixture of gas and liquid streams to mixture heating slot 72. Themixture stream is heated in mixture heating slot 72, vaporizing theatomized liquid in the mixture to form a vapor mixture which exits base16E via outlet 92.

[0069] As shown in FIG. 13, gas slot 70 and mixture heating slot 72 aresealed within base 16E by a pair of faceplates 40. A brazing medium (notshown) may be utilized to seal face plates 40 to surfaces 74 and 78 ofbase 16E by brazing. In an exemplary embodiment, the brazing process issimilar to the brazing process described herein. In an exemplaryembodiment, a nickel medium is used for the brazing process and base 16Eis secured to face plates 40 by vacuum brazing. Alternatively,faceplates 40 may be sealed to the base 16E by way of interconnectapertures 98 provided to receive bolts (not shown). Additionally faceplates 40 may include porting apertures 100 for importing and exportingfluid and/or gas streams directly to base 16E, such as from a flowcontrol valve (not shown). Porting apertures 100 are sealed with acorrosion-resistant seal in an exemplary embodiment. While vaporizer 64Eis shown having a serpentine layout, it is recognized by those skilledin the art that gas slot 70 and mixture heating slot 72 may be anynumber of layouts for heating the gas and mixture, or be essentiallystraight where necessary.

VI. Vaporizer

[0070] In an exemplary embodiment of a vaporizer, a heat exchanger isprovided in fluidic communication with a mixture stream, such as atmixture side 88 of mixing slot 62 of an atomizer as described above. Theheat exchanger can encompass a single continuous pathway, such asmixture heating slot 72, as shown in FIG. 13. The heat exchanger may bein fluid communication with the outlet of an atomizer as describedherein. The heat exchanger provides heat to an atomized liquid streamvaporizing the atomized liquid. Atomizing the liquid in a mixed streamof gas and liquid prior to vaporization lowers the temperature ofvaporization, which may reduce degradation of certain liquid precursors.

[0071] The heat exchanger may be a serpentine pathway, as shown in FIG.13, for heating the atomized mixture to a predetermined temperature forvaporization. The degree of heating is dependent, in part, upon thelength of the pathway and atomized chemistry. Other heat exchangerconfiguration, however, are possible and are within the scope of theinvention.

[0072] In another exemplary embodiment of the present invention, analternate heat exchanger 94F, is shown in FIG. 14. Heat exchanger 94Fmay be used to vaporize atomized liquid in a mixture stream produced byan atomizer 64 or for vaporizing a liquid supplied to the inlet of heatexchanger 94F which is neither atomized nor mixed with a gas stream.Heat exchanger 94F includes a base 16F with an inlet 102 in fluidcommunication with a mixture outlet of an atomizer or an unatomized andunmixed liquid stream. A distribution slot 104 formed in a slot face 106of base 16F is in fluid communication with inlet 102 and a plurality ofseamless slots 18F formed in slot face 106. A plurality of cross-slots108 are formed in face 106 intersecting the plurality of seamless slots18F. The cross-sectional area of the seamless slots is small enough toprevent surface tension from beading the liquid, which would reducecontact with the heated surface and reduce efficient heat transfer.Liquid is turned into vapor by the application of heat. If liquid isheated in a single slot or channel, bubbles of vapor can form that willexpand rapidly and push slugs of liquid to the outlet, causing spitting.The cross-slots allow vapor bubbles to find a path to the outlet withoutpushing a slug of liquid to the outlet. The cross-sectional area of thecross-slots 108 may be larger than the cross-sectional area of theseamless slots 18F to capture slugs of liquid and further reducespitting.

[0073] Although illustrated and described above with reference tocertain specific embodiments, the present invention is nevertheless notintended to be limited to the details shown. Rather, variousmodifications may be made in the details within the scope and range ofequivalents of the claims and without departing from the spirit of theinvention.

What is claimed is:
 1. An integrated fluid delivery system for providinga stream of one or more fluids, comprising: a first modular manifoldhaving seamless slots formed therein for internally channeling the oneor more fluids along the seamless slots, the first modular manifoldreceiving the one or more fluids at corresponding sealed portingapertures thereof; and at least one fluid dispensing device in fluidiccommunication with the first modular manifold for dispensing the streamof one or more fluids.
 2. The integrated fluid delivery system of claim1, wherein the first modular manifold comprises two or more plates eachhaving a first face and a second face; the two or more plates joined sothat a respective one of the faces of each of the two or more platesabuts a respective one of the faces of a different one of the two ormore plates; the seamless slots being formed in one or more of theabutting ones of the faces of the two or more plates, and the portingapertures configured to provide fluid communication between non-abuttingones of the faces of the two or more plates and the seamless slots. 3.The integrated fluid delivery system of claim 2, further comprising slotporting apertures and wherein at least one of the two or more plates hasa first abutting face with the seamless slots formed therein and asecond abutting face; the slot porting apertures configured to providefluid communication between the seamless slots and the second abuttingface.
 4. The integrated fluid delivery system of claim 1, wherein themanifold comprises: a first base, having first and second surfaces, thefirst surface including first seamless slots formed therein, the firstseamless slots including, along surfaces thereof, first sealed portingapertures extending from the first seamless slots through the first baseto the second surface; and a face plate sealed to the first surface ofthe first base for enclosing the first seamless slots.
 5. The integratedfluid delivery system of claim 1, wherein the manifold comprises: afirst base, having a first surface including integrated first seamlessslots formed therein, a face plate sealed to the first surface of thefirst base for enclosing the first seamless slots, the first plateincluding sealed plate porting apertures positioned to overlay the firstseamless slots.
 6. The integrated fluid delivery system of claim 1,wherein the manifold comprises: a first base, having first and secondsurfaces, the first surface including integrated first seamless slotsformed therein, the first seamless slots including, along surfacesthereof, metallic sealed first slot porting apertures extending from thefirst seamless slots through the first base to the second surface; and aface plate sealed to the first surface of the first base for enclosingthe first seamless slots, the first plate including sealed first plateporting apertures positioned to overlay the first seamless slots,wherein the first slot porting apertures are in fluidic communicationwith the first plate porting apertures by way of the seamless slotstherebetween for channeling fluid.
 7. The integrated fluid deliverysystem of claim 4, wherein the first modular manifold includes: (iii) asecond base, the second base having first and second surfaces, the firstsurface of the second base including second seamless slots formedthereon for channeling the one or more fluids therethrough, the secondseamless slots including, along surfaces thereof, second sealed slotporting apertures extending from the surfaces of the second seamlessslots through the second base, the first surface of the second basebeing sealed to the face plate.
 8. The integrated fluid delivery systemof claim 5, wherein the first modular manifold includes: (iii) a secondbase, the second base having first and second surfaces, the firstsurface including integrated second seamless slots formed thereon, thesecond slots including, along surfaces thereof, second sealed slotporting apertures extending from the surfaces of the second slotsthrough the second base, the first surface of the second base beingsealed to the face plate the sealed plate porting apertures of the firstbase overlaying the second integrated slots and the faceplate interposedbetween the first and second bases with the second sealed slot portingapertures in fluidic communication with the first sealed slot portingapertures through the first and second slots for channeling the one ormore fluids therebetween.
 9. The integrated liquid delivery system ofclaim 7, wherein the one or more fluids include a precursor from thegroup consisting of a silicon precursor, a boron precursor and aphosphorous precursor.
 10. A modular manifold for channeling high purityfluid streams of an integrated fluid delivery system, comprising: afirst base, the first base having first and second surfaces, the firstsurface including at least one first seamless slot formed thereon, theat least one first seamless slot including, along a surface thereof, afirst sealed slot porting aperture extending from the surface of thefirst seamless slot through the first base portion; and a face plate,the face plate being sealed to the first surface of the base forenclosing the at least one first seamless slot.
 11. The modular manifoldof claim 10 wherein the face plate includes at least one sealed plateporting aperture positioned to overlay the at least one first seamlessslot, with the at least one first slot porting aperture being in fluidiccommunication with the plate porting aperture by way of the at least onefirst seamless slot.
 12. The modular manifold of claim 10, wherein thefirst seamless slot is elliptical in cross section.
 13. The modularmanifold of claim 10, wherein the first base is sealed to the face plateby brazing.
 14. The modular manifold of claim 13, wherein the first baseis sealed to the face plate by vacuum brazing.
 15. The modular manifoldof claim 14, wherein a nickel brazing medium is utilized.
 16. Themodular manifold of claim 10, wherein the second surface is opposite thefirst surface and the first sealed slot porting aperture extends to thesecond surface.
 17. The modular manifold of claim 10, furthercomprising: a valve secured to the slot porting aperture.
 18. Themodular manifold of claim 10, further comprising: a flow controllersecured to the sealed plate porting aperture.
 19. The modular manifoldof claim 10 further comprising: a second base, the second base havingfirst and second surfaces, the first surface of the second baseincluding a second seamless slot formed thereon, the second seamlessslot including, along a surface thereof, a second sealed slot portingaperture extending from the surface of the second seamless slot throughthe second base, the first surface of the second base being sealed tothe face plate such that the sealed plate porting aperture overlays thesecond seamless slot and the faceplate is interposed between the firstand second bases with the second sealed slot porting aperture in fluidiccommunication with the first sealed slot porting aperture through thesealed, first and second seamless slots.
 20. A modular manifold forchanneling high purity fluid streams of an integrated fluid deliverysystem, comprising: a first base, the first base having first and secondsurfaces, the first surface including a first plurality of integratedseamless slots formed thereon, each one of the first plurality of slotsincluding, along a surface thereof, a first sealed slot porting apertureextending from the surface of the slot through the first base portion; aface plate, the face plate being sealed to the first surface of the basefor enclosing the first plurality of seamless slots, the face plateincluding a plurality of sealed plate porting apertures, each one of theplurality of sealed plate porting apertures positioned to overlay atleast one of the first plurality of seamless slots with the firstplurality of sealed slot porting apertures in fluidic communication withat least a corresponding one of the plurality of sealed plate portingapertures by way of the sealed slots.
 21. The modular manifold of claim20, wherein the first plurality of integrated slots have a smooth andcontinuous cross section.
 22. The modular manifold of claim 20, whereinthe first base is sealed to the face plate by brazing.
 23. The modularmanifold of claim 22, wherein a nickel brazing medium is used.
 24. Themodular manifold of claim 20, wherein the second surface is opposite thefirst surface and the plurality of sealed slot porting apertures extendto the second surface.
 25. The modular manifold of claim 20 furthercomprising: a second base, the second base having first and secondsurfaces, the first surface of the second base including a secondplurality of integrated slots formed thereon, each one of the secondplurality of slots including, along a surface thereof, second sealedslot porting apertures extending from the surface of the slot throughthe second base portion, the first surface of the second base beingsealed to the face plate, each one of the plurality of sealed plateporting apertures positioned to overlay at least one of the secondplurality of integrated slots and the face plate is interposed betweenthe first and second bases with the at least one of the plurality ofsecond sealed slot porting apertures is in fluidic communication with atleast one of the plurality of first sealed slot porting aperturesthrough the sealed, first and second plurality of integrated slots. 26.An integrated fluid delivery system for providing a stream of fluid,comprising: a first modular manifold for internally channeling the fluidalong seamless slots formed therein, the first modular manifoldreceiving one or more fluids at corresponding sealed porting aperturesthereof; and a flow controller in fluidic communication with the firstmodular manifold for dispensing a precise volume of fluid from theintegrated liquid delivery system.
 27. The integrated fluid deliverysystem of claim 26 further comprising an atomizer in fluidiccommunication with the first modular manifold for atomizing a liquidinto a gas stream to provide a stream of fluid comprising a mixture ofan atomized liquid and a gas.
 28. The integrated fluid delivery systemof claim 26 further comprising a vaporizer in fluidic communication withthe first modular manifold for vaporizing a liquid to provide a streamof fluid comprising a vaporized liquid.
 29. A modular manifold forchanneling high purity fluid streams of an integrated fluid deliverysystem, comprising: a first base, the first base having first and secondsurfaces, the first surface including at least one first seamless slotformed thereon, the at least one first seamless slot including, along asurface thereof, a first sealed porting aperture extending from thesurface of the first seamless slot through the first base, the firstsealed porting aperture being sealed with a metal seal; and a faceplate, the face plate being sealed to the first surface of the firstbase enclosing the at least one first seamless slot.